TM21R Series q Modular Jack Connectors for High-Speed LAN Transmission
B Recommended PCB mounting patterns
q With Built-in Optical Pipe
11.9
8.89
q Without Optical Pipe
6.35
3.81
1.27
LED location area
LED light emission area
No ground traces
3
8.89
6.35
3.81
1.27
Contact No.
1
Contact No.
1
No ground traces
3
7
8
6
5
4
3
1
2
2-
?3
.2
7
8
6
5
4
3
1
2
Printed board edge
Printed board edge
11.43
Connector front edge 11.43MIN
11.43
Connector front edge 11.43MIN
15.75
No conductive traces
2
15.75
No conductive traces
2
* Recommendations for PCB Design
1 The contact arrangement differs between the contact area side and Printed board side.
(1,2,3,4,5,6,7,8 on the contact are side / 2,1,3,4,5,6,8,7 on the printed board side)
2 Areas indicated should be free of conductive traces.
3 Area indicated should be free of ground traces.
1
PCB mounting pattern
Other Series TM21R Series
7 5 3 1 8 5 3 2
4 Recommended board thickness: 1.6mm.
5 To assure that the indicator light pipes operates correctly the LED ' s must be
8 6 4 2
7 6 4 1
installed directly on the PCB, within recommended dimensions and with light
5
Suggested LEDs
emitting center in upward direction.
Contact applicable manufacturer for LED specification.
B Panel Cutout
q For Both Types, With and Without Built-in Optical Pipe
2.7MAX
LED light emitting center
1.5MAX
-2 1
(33)
4.5
+1
4.5MIN
TM21P--88P
Lock lever
TM21R--5C--88--LP
PCB mounting surface
Panel side
1
Connector front surface
2.8 -0.8
16.4
1
0
6.75
10.25
* Recommendations for Panel Design
1 The shield contacts should connect with the panel cut-out on all sides.
Note: IPA cleaning at room temperature is recommended for the cleaning of this product.
When an aqueous cleaning agent is to be used, there is a concern that the light pipe (made of polycarbonate resin) may
change color; therefore, please make a selection based on a table showing the effects on the resin. These tables are issued
by the various manufacturers of cleaning agents.
4
相关PDF资料
TMC-6 SURGE SUPPR 6OUT 6'CORD
TMDSEMU100V2U-ARM XDS100 USB JTAG EMULATOR
TMDSEVM355 TMDSEVM355
TMDX5535EZDSP KIT DEV EZDSP USB STICK C5535
TMDXEVM5515 EVAL MODULE DSP FOR C55XX
TMDXEXP1808L KIT EXPERIMENTER FOR AM180X
TO263-3EV-VREG BOARD EVAL TO220-3/TO263-3 VREG
TO263-5EV-VREG EVAL BOARD VREG TO220-5/TO263-5
相关代理商/技术参数
TM21R-5B-3232D-LP(50) 功能描述:以太网和电信连接器 MOD JCK 8X8-8 GANGED RoHS:否 制造商:Pulse 产品:Modular Jacks 性能类别: USOC 代码:RJ45 位置/触点数量: 安装风格:Through Hole 端口数量:1 x 1 型式:Female 屏蔽: 电流额定值: 电压额定值: 触点电镀: 外壳材料:Thermoplastic IP 等级:
TM21R-5B-4848D-LP 制造商:Hirose 功能描述:222-2885-4-00 EACH
TM21R-5B-4848D-LP(50) 功能描述:以太网和电信连接器 12PORT JACK W/LP RoHS:否 制造商:Pulse 产品:Modular Jacks 性能类别: USOC 代码:RJ45 位置/触点数量: 安装风格:Through Hole 端口数量:1 x 1 型式:Female 屏蔽: 电流额定值: 电压额定值: 触点电镀: 外壳材料:Thermoplastic IP 等级:
TM21R5B4848DLP50 制造商:Hirose 功能描述:
TM21R-5C-88 功能描述:以太网和电信连接器 8P F MODULAR JACK EMI PROTECTION T/H RoHS:否 制造商:Pulse 产品:Modular Jacks 性能类别: USOC 代码:RJ45 位置/触点数量: 安装风格:Through Hole 端口数量:1 x 1 型式:Female 屏蔽: 电流额定值: 电压额定值: 触点电镀: 外壳材料:Thermoplastic IP 等级:
TM21R-5C-88(50) 功能描述:以太网和电信连接器 MOD JACK CAT5E 8-8 RoHS:否 制造商:Pulse 产品:Modular Jacks 性能类别: USOC 代码:RJ45 位置/触点数量: 安装风格:Through Hole 端口数量:1 x 1 型式:Female 屏蔽: 电流额定值: 电压额定值: 触点电镀: 外壳材料:Thermoplastic IP 等级:
TM21R-5C-88-LP 功能描述:以太网和电信连接器 8P F MODULAR JACK BUILT IN OPTICAL T/H RoHS:否 制造商:Pulse 产品:Modular Jacks 性能类别: USOC 代码:RJ45 位置/触点数量: 安装风格:Through Hole 端口数量:1 x 1 型式:Female 屏蔽: 电流额定值: 电压额定值: 触点电镀: 外壳材料:Thermoplastic IP 等级:
TM21R-5C-88-LP(10) 功能描述:以太网和电信连接器 8P F MODULAR JACK BUILT IN OPTICAL T/H RoHS:否 制造商:Pulse 产品:Modular Jacks 性能类别: USOC 代码:RJ45 位置/触点数量: 安装风格:Through Hole 端口数量:1 x 1 型式:Female 屏蔽: 电流额定值: 电压额定值: 触点电镀: 外壳材料:Thermoplastic IP 等级: